H. Reichl

Investigations of laser soldered TAB inner lead contacts

E. Zakel, G. Azdasht, H. Reichl, 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps

Herbert Reichl, Elke Zakel, A. Ostmann, 1996, Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium.

Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation

H. Reichl, R. Dudek, A. Schubert, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

The use of the FPC-laser method for different chip interconnection techniques

E. Zakel, P. Kasulke, G. Azdasht, 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.

A highly flexible design and production framework for modularized microelectromechanical systems

H. Reichl, R. Leutenbauer, V. Grosser, 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.

High power multichip modules employing the planar embedding technique and microchannel water heat sinks

Herbert Reichl, Oswin Ehrmann, M. Topper, 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

Flip chip molding - highly reliable flip chip encapsulation

Herbert Reichl, K.-F. Becker, Rolf Aschenbrenner, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy

H. Reichl, G. Engelmann, E. Zakel, 1994, Proceedings of 16th IEEE/CPMT International Electronic Manufacturing Technology Symposium.

Reliability study of flip chip on FR4 interconnections with ACA

Herbert Reichl, R. Aschenbrenner, R. Miessner, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Low cost electroless copper metallization of BCB for high-density wiring systems

H. Reichl, M. Topper, T. Stolle, 1999, Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).

Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates

Herbert Reichl, Joachim Kloeser, E. Zakel, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Chip-in-polymer: volumetric packaging solution using PCB technology

C. Landesberger, Andreas Ostmann, Herbert Reichl, 2002, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.

Alternative solders for flip chip applications in the automotive environment

Herbert Reichl, R. Aschenbrenner, Joachim Kloeser, 1998, Twenty Second IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEMT-Europe 1998. Electronics Manufacturing and Development for Automotives (Cat. No.98CH36204).

Shear test for adhesion measurement of small structures

Herbert Reichl, K. Buschick, Rainer Hahn, 1996, 1996 International Integrated Reliability Workshop Final Report.

Design, simulation and technological realization of a reliable packaging concept for high power laser bars

Herbert Reichl, R. Aschenbrenner, Eberhard Kaulfersch, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).