T. Ohno

UV/EB Cure Mechanism for Porous PECVD/SOD Low-k SiCOH Materials

S. Kondo, J. Ushio, T. Hamada, 2006, 2006 International Interconnect Technology Conference.

Molecular modeling of low-k films of carbon-doped silicon oxides for theoretical investigations of the mechanical and dielectric properties

T. Hamada, N. Tajima, K. Yoneda, 2006 .

First-principle molecular model of PECVD SiOCH film for the mechanical and dielectric property investigation

T. Hamada, N. Tajima, K. Yoneda, 2005, Proceedings of the IEEE 2005 International Interconnect Technology Conference, 2005..

Historical Review and State-of-the-art of Researches on the Behaviors of RC Slabs subjected to Projectile Impact

T. Ohno, 2003 .