D. Kang
发表
Junyoung Park,
U. Kang,
Kwangok Jeong,
2022,
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Plastic analysis for through silicon via with actual etching defect of triangular-teeth and scallops
Dongwoo Kang,
Yan Wang,
Guifu Ding,
2017,
Microelectron. Reliab..