Shunfeng Han

Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package

Fengman Liu, Dejian Li, Shunfeng Han, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

The multi-dimension co-design for the package of the high-speed multi-function chip

Fengman Liu, Huimin He, Dejian Li, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).

The latest research status and prospect on microwave technology for monitoring concerned brain activity

Song Wu, Miao Cai, Xiang Wan, 2015, 2015 IEEE International Conference on Mechatronics and Automation (ICMA).