Bofu Li

Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package

Fengman Liu, Dejian Li, Shunfeng Han, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

The multi-dimension co-design for the package of the high-speed multi-function chip

Fengman Liu, Huimin He, Dejian Li, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).