Xin Liao

Machine Learning Regression-Based Single-Event Transient Modeling Method for Circuit-Level Simulation

Yintang Yang, Yi Liu, Changqing Xu, 2021, IEEE Transactions on Electron Devices.

Comparison in radiation tolerance between FLR planar junction termination and positive bevel edge termination for power diodes

Chen Wang, Changqin Xu, Yi Liu, 2022, Microelectron. J..

A possible single event burnout hardening technique for SiC Schottky barrier diodes

Yintang Yang, Jialiang Cheng, Yi Liu, 2021, Superlattices and Microstructures.

Single Event Burnout Hardening Technique for High-Voltage p-i-n Diodes With Field Limiting Rings Termination Structure

Yintang Yang, Changqin Xu, Yi Liu, 2022, IEEE Transactions on Electron Devices.

Research on Temperature Dependence of Single-Event Burnout in Power MOSFETs

Dongdong Chen, Chen Wang, Changqin Xu, 2023, Micromachines.

Simulation Aided Hardening of Power Diodes to Prevent Single Event Burnout

Yintang Yang, Changqin Xu, Yi Liu, 2022, IEEE Transactions on Electron Devices.

A Fast Simulation Method for Evaluating the Single-Event Effect in Aerospace Integrated Circuits

Yintang Yang, Dongdong Chen, Changqin Xu, 2023, Micromachines.