S. Vivegnis

Use of pyrophosphate and boric acid additives in the copper-zinc alloy electrodeposition and chemical dealloying

J. Delhalle, Z. Mekhalif, F. Renner, 2019, Journal of Electroanalytical Chemistry.

Copper–zinc alloy electrodeposition mediated by triethanolamine as a complexing additive and chemical dealloying

J. Delhalle, Z. Mekhalif, F. Renner, 2019, Electrochimica Acta.

XPS fast depth profile of the native oxide layers on AISI 304, 316 and 430 commercial stainless steels and their evolution with time

J. Delhalle, Z. Mekhalif, P. Louette, 2020 .

Electrodeposition of silicon films from organic solvents on nanoporous copper substrates

J. Delhalle, Z. Mekhalif, F. Renner, 2023, Journal of Applied Electrochemistry.