M. Pecht
发表
Jie Gu,
M. Pecht,
2007,
2007 8th International Conference on Electronic Packaging Technology.
M.H. Azarian,
M. Pecht,
Sheng Zhan,
2008,
IEEE Transactions on Device and Materials Reliability.
M. Pecht,
A.T. Michael,
S. Kumar,
2008,
2008 2nd Electronics System-Integration Technology Conference.
M. Pecht,
1995,
IEEE Power Engineering Review.
M. Osterman,
M. Pecht,
S.W.R. Lee,
2006,
2006 International Conference on Electronic Materials and Packaging.
M. Pecht,
M. Pecht,
2001,
Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506).
M. Pecht,
Yuki Fukuda,
P. Casey,
2003
.
M. Pecht,
P. Matkowski,
J. Felba,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Ming Xu,
M. Pecht,
M. Pecht,
2005,
Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC..
M. Osterman,
M. Pecht,
Fubin Song,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Osterman,
M. Pecht,
M. Pecht,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Pecht,
M. M. Ohadi,
S. V. Dessiatoun,
2012,
2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
M. Osterman,
M. Pecht,
M. Pecht,
2008,
IEEE Transactions on Device and Materials Reliability.
M. Pecht,
R. Martens,
1996,
Electrical Contacts - 1996. Proceedings of the Forty-Second IEEE Holm Conference on Electrical Contacts. Joint with the 18th International Conference on Electrical Contacts.
A. Bar-Cohen,
M. Osterman,
M. Pecht,
2009,
IEEE Transactions on Device and Materials Reliability.
M. Pecht,
Ping Zhao,
2005,
IEEE Transactions on Device and Materials Reliability.
M. Osterman,
M. Pecht,
M. Pecht,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
Qiang Yu,
M. Osterman,
M. Pecht,
2012,
Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing).
Haiyu Qi,
M. Osterman,
M. Pecht,
2004,
Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809).
M. Osterman,
M. Pecht,
M. Pecht,
2006,
IEEE Transactions on Electronics Packaging Manufacturing.
M. Pecht,
E. W. M. Ma,
M. Pecht,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
Qiang Yu,
T. Shibutani,
M. Osterman,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
M. Osterman,
M. Pecht,
M. Pecht,
2007,
IEEE Transactions on Electronics Packaging Manufacturing.
M. Pecht,
M. Lee,
Y. Hwang,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).