R. Paul

Photonic spiking neural networks and CMOS-compatible graphene-on-silicon spiking neurons

B. Shastri, Chaoran Huang, Hsuan-Tung Peng, 2022 .

300mm Heterogeneous 3D Integration of Record Performance Layer Transfer Germanium PMOS with Silicon NMOS for Low Power High Performance Logic Applications

G. Dewey, B. Chu-Kung, J. Kavalieros, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

Novel STT/SHE MTJ Compact Model Compatible with NGSPICE

R. Paul, S. Verma, Jagadish Rajpoot, 2022, 2208.14055.

3D heterogeneous integration of high performance high-K metal gate GaN NMOS and Si PMOS transistors on 300mm high-resistivity Si substrate for energy-efficient and compact power delivery, RF (5G and beyond) and SoC applications

M. Radosavljevic, H. Then, W. Rachmady, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

3-D Self-aligned Stacked NMOS-on-PMOS Nanoribbon Transistors for Continued Moore’s Law Scaling

G. Dewey, J. Kavalieros, M. Metz, 2020, 2020 IEEE International Electron Devices Meeting (IEDM).

GaN and Si Transistors on 300mm Si(111) enabled by 3D Monolithic Heterogeneous Integration

M. Radosavljevic, H. Then, W. Rachmady, 2020, 2020 IEEE Symposium on VLSI Technology.