W. Aderhold

The impact of iron, copper, and calcium contamination of silicon surfaces on the yield of a MOS DRAM test process

E. Burte, W. Aderhold, 1997 .

Low-Resistance Titanium Contacts and Thermally Unstable Nickel Germanide Contacts on p-Type Germanium

T. Schram, K. Barla, N. Horiguchi, 2016, IEEE Electron Device Letters.

GOI Impact of Cu, Ni and Al Atoms on the Wafer Surface Prior to RTP and Furnace Oxidations

A. Bauer, E. Burte, S. Bogen, 1996 .

Ultralow-resistivity CMOS contact scheme with pre-contact amorphization plus Ti (germano-)silicidation

A. Hikavyy, S. Chew, E. Rosseel, 2016, 2016 IEEE Symposium on VLSI Technology.

Electrical properties of thin reoxidized dual-layer oxides

H. Ryssel, A. Bauer, E. Burte, 1993 .