Z. Zhang

Thermal conductivity studies of a GaN-sapphire structure by combined scanning thermal microscopy and electron backscatter diffraction

R. Heiderhoff, L. Balk, A.-K. Tiedemann, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Direct Observation of Super‐Plasticity of Beta‐SiC Nanowires at Low Temperature

X. Guo, Y. Zhang, K. Zheng, 2007 .

In situ nanomechanical measurement of Cu nanowires

Y. Zhang, Z. Zhang, J. Ma, 2013, International Symposium on the Physical and Failure Analysis of Integrated Circuits.