Zi-Hong Yang

Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips

Po-Ching Wu, T. Chuang, Zi-Hong Yang, 2022, Scientific Reports.

Low-Temperature Die Bonding of SiC Chips with DBC Ceramic Substrates Using High-Density Ag (111) Nanotwinned Films

Yen‐Ting Chen, T. Chuang, Zi-Hong Yang, 2023, Journal of Materials Engineering and Performance.

Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films

T. Chuang, Y. Lai, Zi-Hong Yang, 2023, Journal of Materials Engineering and Performance.

Resonant inelastic x-ray scattering from electronic excitations in α−RuCl3 nanolayers

T. Taniguchi, J. Smet, B. Lotsch, 2023, Physical Review B.

Ion Bombardment-Induced Stress Mechanism for the Formation of Ag Nanotwinned Films on Si Substrates

Po-Ching Wu, Zi-Hong Yang, Yin-Hsuan Chen, 2024, Journal of Electronic Materials.