K. Suetsugu

发表

Tensile Properties of Bi Alloys and a Case Study for Alloy Design in Their Application to High Temperature Solders

Yongbum Choi, Meiqi Yu, Zhe-feng Xu, 2017 .

Novel Ultrasonic Soldering Technique for Lead-Free Solders

K. Ishida, K. Matsushige, T. Horiuchi, 2004 .

Non-Equilibrium Thermodynamic Theory of 4-Component Lead-Free Solder

K. Matsushige, T. Horiuchi, Atsushi Yamaguchi, 2009 .

Strength of bonding interface in lead-free Sn alloy solders

K. Matsushige, S. Kikuchi, K. Suetsugu, 2001 .

Atmospheric Pressure Plasma Treatment and Non-Flux Lead-Free-Soldering of Cu Wire and Strand

Akio Furusawa, K. Suetsugu, T. Okumura, 2006 .

Application of Spark Sintering to Preparation of Zn-50Sn-Al2O3/Cu Joints for AC-Low Voltage Fuse Elements Without Lead

Yongbum Choi, K. Matsugi, K. Fujii, 2016 .

Control of Electrical and Thermal Properties by 8 vol% Al2O3 Distribution States in Zn–50Sn for AC-Low Voltage Fuses

Yongbum Choi, K. Matsugi, G. Sasaki, 2014 .

Control of Electrical and Thermal Properties on Sn–50Zn Alloy by 8 vol%Al2O3 Addition for Pb-Free AC-Low Voltage Fuse Elements

Yongbum Choi, K. Matsugi, G. Sasaki, 2013 .

Application and Compositional Optimization of Zn Alloys for High Temperature Solders

Yongbum Choi, Meiqi Yu, K. Matsugi, 2016 .