N. Strifas

Materials interfaces in flip chip interconnects for optical components; performance and degradation mechanisms

A. Dimoulas, A. Christou, R. Esser, 1998 .

Accelerated reliability predictions-thermomechanical fatigue solder joints methodology

M. Ruzzene, N. Strifas, C. Vaughan, 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

Accelerated reliability - thermal and mechanical fatigue solder joints methodologies

M. Ruzzene, N. Strifas, C. Vaughan, 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

High Performance CuMetallized GaAs HEMTs Processing and Reliability

A. Dimoulas, A. Christou, T. Feng, 1998 .