Karim Inal

Robust design of thermo-mechanical MEMS switch embedded in aluminium BEOL interconnect

Pierre Montmitonnet, Sebastian Orellana, B. Arrazat, 2015, Microelectron. Reliab..

Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices

Pierre Montmitonnet, Karim Inal, J. L. Muraro, 2015, Microelectron. Reliab..

Distribution des contraintes dans l’acier bainitique 16MND5. Analyse expérimentale et modélisation polycristalline

Renaud Masson, Karim Inal, Marcel Berveiller, 2003 .

Packaging induced stress effects investigations on 40nm CMOS technology node: Measurements and optimization of device shifts

Pierre-Olivier Bouchard, Vincent Fiori, Sebastien Gallois-Garreignot, 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence

Pierre Montmitonnet, Stéphane Moreau, David Bouchu, 2015, Microelectron. Reliab..

Hemispherical curved monolithic cooled and uncooled infrared focal plane arrays for compact cameras

Yann Gaeremynck, Manuel Fendler, Guillaume Druart, 2014, Defense + Security Symposium.

Numerical Investigations of Smart Card Module

Karim Inal, M. Su, Xavier Boddaert, 2008 .

A micromechanical interpretation of the temperature dependence of Beremin model parameters for french RPV steel

Karim Inal, Jean-Philippe Mathieu, K. Inal, 2010 .

Microscale modelling of cleavage fracture at low temperatures: influence of heterogeneities at the granular scale

Karim Inal, Jean-Philippe Mathieu, K. Inal, 2006 .

Analysis of the martensitic transformation at various scales in TRIP steel

Etienne Patoor, Karim Inal, A. Moulin, 2004 .

Investigations of Thermomechanical Stress Induced by TSV-Middle (Through-Silicon via) in 3-D ICs by Means of CMOS Sensors and Finite-Element Method

Pierre-Olivier Bouchard, Vincent Fiori, Sebastien Gallois-Garreignot, 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications

V. Mandrillon, Karim Inal, H. Boutry, 2010 .