C. Bailey
发表
S. Alii,
C. Bailey,
2004
.
D. Katz,
C. Bailey,
F. Kasper,
1965
.
Huibin Shi,
C. Bailey,
2004
.
C. Bailey,
S. Alli,
2004
.
T. Tilford,
C. Bailey,
M. P. Y. Desmulliez,
2009,
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
C. Bailey,
S. Stoyanov,
B. Hughes,
2008,
2008 2nd Electronics System-Integration Technology Conference.
N. Strusevich,
N. Dumas,
C. Bailey,
2006,
2006 8th Electronics Packaging Technology Conference.
C. Bailey,
K. Dhinsa,
K. Pericleous,
2004,
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).
C. Bailey,
D. Gwyer,
D. Philpott,
2002,
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).
H. Lu,
C. Bailey,
A. Guedon-Gracia,
2010,
2010 IEEE CPMT Symposium Japan.
G. Goussetis,
S. K. Pavuluri,
M. Ferenets,
2012,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
M. O. Alam,
C. Bailey,
S. Stoyanov,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
H. Lu,
C. Bailey,
C.Y. Yin,
2005,
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
H. Lu,
C. Bailey,
Y. Chan,
2008,
2008 2nd Electronics System-Integration Technology Conference.
Xiangdong Xue,
C. Bailey,
M. Kersaudy-Kerhoas,
2008,
2008 2nd Electronics System-Integration Technology Conference.
C. Bailey,
B.Y. Wu,
Y. Chan,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
M. Hughes,
C. Bailey,
A. Malik,
2006,
2006 1st Electronic Systemintegration Technology Conference.
H. Lu,
C. Bailey,
Dinesh Chamund,
2010,
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
C. Bailey,
S. Stoyanov,
J. Roulston,
2012,
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Y. C. Chan,
Hua Lu,
C. Bailey,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
H. Lu,
C. Bailey,
C.Y. Yin,
2005,
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
Xiangdong Xue,
Hua Lu,
T. Tilford,
2007,
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
C. Bailey,
S. Stoyanov,
D. Jibb,
2004,
Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971).
C. Bailey,
S. Stoyanov,
C. Bailey,
2007,
IEEE Transactions on Components and Packaging Technologies.
M. O. Alam,
C. Bailey,
S. Stoyanov,
2012,
2012 35th International Spring Seminar on Electronics Technology.
C. Bailey,
K. Dhinsa,
K. Pericleous,
2005,
2005 International Symposium on Electronics Materials and Packaging.
C.M. Johnson,
Hua Lu,
C. Bailey,
2008,
2008 2nd Electronics System-Integration Technology Conference.