Li Rao

Research on the interfacial reaction and mechanism of Cu/Sn/Ni copper pillar bump

Anmin Hu, Liming Gao, Ming Li, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Selectively Sequestrating Aqueous Bi(Iii) with Titanium Pyrophosphate Polyhedral Submicro-Particles

Dong Chen, Guangrong Liu, Zilin Huang, 2022, SSRN Electronic Journal.

Influence of solder cap thickness on the interfacial reaction in Cu/Sn/Ni copper pillar bump

Huiqin Ling, Anmin Hu, Ming Li, 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

Superior Reliability of SAC105 Solder on BGA Package Pad with NiPdAu Coating

Ming Li, Menglong Sun, Li Rao, 2018, Journal of Electronic Materials.

Thermally Regenerable Fes/N-Doped Biochar Catalyzed Peroxydisulfate Oxidative Destruction of Aqueous Triclosan

Guangrong Liu, Feifei He, Zilin Huang, 2023, SSRN Electronic Journal.