D. Hongqun

Interfacial reactions between SnAg1.0Ti and Ni metallization

T. Laurila, V. Vuorinen, D. Hongqun, 2012, Journal of Materials Science: Materials in Electronics.

Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system

T. Laurila, Praveen Kumar, V. Vuorinen, 2016 .