J. Loman

Note on the thermal stresses in passivated metal interconnects

P. Sharma, H. Ardebili, J. Loman, 2001 .

Reliability importance of components in a complex system

P. Vassiliou, Wendai Wang, J. Loman, 2004, Annual Symposium Reliability and Maintainability, 2004 - RAMS.

Estimating Traveling Wave Tubes (TWTs) Failure Rate Using Bayesian Posterior Analysis From Spacecraft On-Orbit Flight Data

Randall Ortland, Wei Huang, James Loman, 2017, IEEE Transactions on Device and Materials Reliability.

Durability of Pb‐free solder between copper interconnect and silicon in photovoltaic cells

A. Dasgupta, G. Cuddalorepatta, J. Moyer, 2010 .

Prediction of rate-independent constitutive behavior of Pb-free solders based on first principles

Abhijit Dasgupta, J. Loman, Pradeep Sharma, 2003 .

Durability of Pb-Free solder connection between copper interconect wire and crystalline silicon solar cells

J. Loman, A. Dasgupta, G. Cuddalorepatta, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Reliability/availability of K-out-of-N system with M cold standby units

Wendai Wang, J. Loman, Wendai Wang, 2002, Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318).

Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability

Wei Huang, James M. Loman, Bülent Sener, 2002, Microelectron. Reliab..

Reliability block diagram simulation techniques applied to the IEEE Std. 493 standard network

D. Ogden, R.G. Arno, Wendai Wang, 2004, IEEE Transactions on Industry Applications.

On reliability modeling and analysis of highly-reliable large systems

Wendai Wang, J. Loman, Wendai Wang, 2002, Annual Reliability and Maintainability Symposium. 2002 Proceedings (Cat. No.02CH37318).