Sen Cao

Failure analysis on the mechanical property of Through-Silicon Vias interface using a cohesive zone model

Zhuo Chen, Wenhui Zhu, Honglong Luo, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Thermal conductivity of amorphous SiO2 thin film: A molecular dynamics study

Wenhui Zhu, Hu He, G. Zheng, 2018, Scientific Reports.

Defect induced phonon scattering for tuning the lattice thermal conductivity of SiO2 thin films

Wenhui Zhu, Hu He, Sen Cao, 2017 .

Thermal conductivity of amorphous SiO2 thin film: A molecular dynamics study

Wenhui Zhu, Hu He, G. Zheng, 2018, Scientific Reports.

An effective and efficient numerical method for thermal management in 3D stacked integrated circuits

Junhui Li, Chengdi Xiao, Wenhui Zhu, 2017 .