Huayu Sun

Ptpd Nanoparticles on Lacoo3 With Ruthenium in the Interfaces for Co Oxidation

Hao Wang, Xitao Wang, K. An, 2022, SSRN Electronic Journal.

Highly Stable Bi-Metal Ni-Co on Alumina Covered Spinel Oxide Derived from High Entropy Oxide for Co2 Methanation

Xitao Wang, Ziyang Zhang, Pengfei Song, 2022, SSRN Electronic Journal.

The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints

Y. Chan, Fengshun Wu, Huayu Sun, 2015, Journal of Materials Science: Materials in Electronics.

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Y. Chan, Qingqian Li, Huayu Sun, 2014, Journal of Materials Science: Materials in Electronics.

Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs

Y. Chan, Fengshun Wu, Huayu Sun, 2018, Journal of Materials Science: Materials in Electronics.

Fabrication and characterizations of frequency-tunable soft composite antennas for wireless sensing

Y. Chan, K. Leung, Y. Pan, 2012, The 8th European Conference on Antennas and Propagation (EuCAP 2014).

Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

Y. Chan, Fengshun Wu, Huayu Sun, 2015, Journal of Materials Science: Materials in Electronics.

Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

Y. Chan, Ze‐Lin Zhu, Fengshun Wu, 2016, Journal of Materials Science: Materials in Electronics.

Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints

Y. Chan, Fengshun Wu, Xiao Hu, 2017, 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).