Sen-Ming Xue

Construction and Verification of Hyperelastic Constitutive for Polymer Materials

Jibao Lu, Xu Peng, Rong Sun, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains

Zhi-Quan Liu, Xianguyan Zeng, Sen-Ming Xue, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).