C. Ferrandon

A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications

O. El Bouayadi, C. Ferrandon, Laurent Dussopt, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Some Strategic Tracks to Optimize Routing of High Speed Signal Transmission Between Memory and Logic in 3D-IC Stacks

C. Ferrandon, Thierry Lacrevaz, Bernard Flechet, 2013 .

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration

C. Ferrandon, S. Joblot, C. Laviron, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logic

C. Ferrandon, S. Capraro, A. Farcy, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Electrical characterization and impact on signal integrity of new basic interconnection elements inside 3D integrated circuits

C. Ferrandon, S. Capraro, A. Farcy, 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

Copper pillar interconnect capability for mmwave applications in 3D integration technology

Yann Lamy, C. Ferrandon, H. Sibuet, 2013 .

Hermetic wafer-level packaging development for RF MEMS switch

C. Ferrandon, P. Rey, X. Baillin, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Solder joint fatigue model for large silicon interposers

C. Ferrandon, F. de Crecy, S. Moreau, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).