Thierry Lacrevaz

发表

Thierry Lacrevaz, Patrick Leduc, Alexis Farcy, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Yann Lamy, Thierry Lacrevaz, Bernard Flechet, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).

Thierry Lacrevaz, Cedric Bermond, Bernard Flechet, 2008 .

Thierry Lacrevaz, Cedric Bermond, Philippe Artillan, 2019, 2019 IEEE 23rd Workshop on Signal and Power Integrity (SPI).

Thierry Lacrevaz, Pascal Ancey, Christian Gontrand, 2009, 2009 IEEE International Conference on 3D System Integration.

Thierry Lacrevaz, Bernard Flechet, Alexis Farcy, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Thierry Lacrevaz, Bernard Flechet, Blaise Ravelo, 2013, 2013 17th IEEE Workshop on Signal and Power Integrity.

Thierry Lacrevaz, Bernard Flechet, Blaise Ravelo, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Thierry Lacrevaz, Alexis Farcy, Cédric Bermond, 2014, 2014 International 3D Systems Integration Conference (3DIC).

Thierry Lacrevaz, Alexis Farcy, Philippe Artillan, 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI).

Yann Lamy, Thierry Lacrevaz, Alexis Farcy, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Thierry Lacrevaz, Lionel Cadix, Alexis Farcy, 2009, 2009 IEEE International Conference on 3D System Integration.

Yann Lamy, Thierry Lacrevaz, Bernard Flechet, 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Thierry Lacrevaz, Bernard Flechet, Cedric Bermond, 2009 .