Sujie Li

发表

Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition

Xiaojing Wang, Jie Yuan, Sujie Li, 2019, Materials Science and Engineering: A.

Microstructure and mechanical behavior of Sn–40Bi–xCu alloy

Xiaojing Wang, Jiaoxia Zhang, Xulei Wu, 2017, Journal of Materials Science: Materials in Electronics.

Communication—Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect

Cai-Fu Li, Chunzhong Liu, Sujie Li, 2018, Journal of The Electrochemical Society.