Yuki Kawana
发表
Y. Ejiri,
B. An,
B. Leyrer,
2018,
2018 7th Electronic System-Integration Technology Conference (ESTC).
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2016,
2016 International Conference on Electronics Packaging (ICEP).
Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-Attach Material
T. Terasaki,
M. Nishimura,
Tomohisa Suzuki,
2016,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Matsuda,
T. Morita,
2019,
IEEE Transactions on Device and Materials Reliability.
T. Terasaki,
T. Morita,
Y. Yasuda,
2018,
IEEE Transactions on Device and Materials Reliability.
H. Nakako,
Motohiro Negishi,
D. Ishikawa,
2022,
Journal of The Japan Institute of Electronics Packaging.
Y. Ejiri,
H. Nakako,
Motohiro Negishi,
2017
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