Pearl A. Agyakwa

A thermal cycling reliability study of ultrasonically bonded copper wires

Bassem Mouawad, C. Mark Johnson, Jianfeng Li, 2016, Microelectron. Reliab..

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

Li Yang, C. Mark Johnson, J. F. Li, 2011, Microelectron. Reliab..

Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods

C. Mark Johnson, Elaheh Arjmand, Pearl A. Agyakwa, 2014, Microelectron. Reliab..

A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects

Li Yang, C. Mark Johnson, Pearl A. Agyakwa, 2011, Microelectron. Reliab..

Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement

Li Yang, C. Mark Johnson, Pearl A. Agyakwa, 2016, Microelectron. Reliab..

Degradation of thermal interface materials for high-temperature power electronics applications

C. Mark Johnson, J. F. Li, Pearl A. Agyakwa, 2013, Microelectron. Reliab..

Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator

Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.