Martin R. Corfield

A thermal cycling reliability study of ultrasonically bonded copper wires

Bassem Mouawad, C. Mark Johnson, Jianfeng Li, 2016, Microelectron. Reliab..

Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling

Li Yang, C. Mark Johnson, J. F. Li, 2011, Microelectron. Reliab..

Repetitive high peak current pulsed discharge film-capacitor reliability testing

C. Mark Johnson, Patrick Wheeler, Alberto Castellazzi, 2012, Microelectron. Reliab..

Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator

Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, 2016, IEEE Transactions on Components, Packaging and Manufacturing Technology.