Jean Michailos

8.1 a 4x4x2 homogeneous scalable 3d network-on-chip circuit with 326mflit/s 0.66pj/b robust and fault-tolerant asynchronous 3d links

Christian Bernard, Fabien Clermidy, Frédéric Pétrot, 2016, 2016 IEEE International Solid-State Circuits Conference (ISSCC).

Challenges and capabilities of 3D integration in CMOS imaging sensors

Dominique Thomas, Jean Michailos, Krysten Rochereau, 2019, ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC).

Integration Aspects of the Implementation of Through Silicon Vias (TSV) for CMOS Image Sensors

Yiping Song, Jean Michailos, Dave Thomas, 2010 .

Amorphous silicon x-ray image sensor

Thierry Ducourant, Marc Arques, Heinz Horbaschek, 1996, Medical Imaging.

ITAC: A complete 3D integration test platform

Karim Azizi-Mourier, Stéphane Moreau, Gaël Pillonnet, 2016, 2016 IEEE International 3D Systems Integration Conference (3DIC).

A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC

Christian Bernard, Fabien Clermidy, Yvain Thonnart, 2013, 2013 Symposium on VLSI Technology.

3D integration demonstration of a wireless product with design partitioning

Pascal Ancey, Laurent-Luc Chapelon, F. Leverd, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links

Christian Bernard, Fabien Clermidy, Frédéric Pétrot, 2017, IEEE Journal of Solid-State Circuits.

Thermal correlation between measurements and FEM simulations in 3D ICs

François de Crecy, M. Haykel Ben Jamaa, Alexis Farcy, 2013, 2013 IEEE International 3D Systems Integration Conference (3DIC).

Color filters including infrared cut-off integrated on CMOS image sensor.

Catherine Pellé, Laurent Frey, Didier Hérault, 2011, Optics express.