K. H. Lee

Drop Tests of a Type IP-2 Transport Package with a Bolted Lid

D. H. Kim, K. S. Seo, K. J. Jung, 2006 .

Comprehensive treatment of moisture induced failure-recent advances

Ranjan Rajoo, K. H. Lee, K. Lee, 2002 .

Structure modification of magnetron-sputtered CrN coatings by intermediate plasma etching steps

K. H. Lee, K. Lee, H. Kappl, 2000 .

Advanced moisture diffusion modeling and characterisation for electronic packaging

Ranjan Rajoo, K. H. Lee, E. Wong, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Effect of preheating on the residual stress in type 304 stainless steel weldment

K. H. Lee, Yur-Tsai Lin, Yur-Tsai Lin, 1997 .