Kyung-Yeol Kim

Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test

Sang‐Woo Kim, Haksan Jeong, Seung-Boo Jung, 2020 .

Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate

Haksan Jeong, W. Myung, Seung-Boo Jung, 2018 .

RF Characterization in Range of 18GHz in Fan-out Package Structure Molded by Epoxy Molding Compound with EMI Shielding Property

S. Jung, Kyung Deuk Min, Haksan Jeong, 2022, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

S. Jung, Yongil Kim, W. Myung, 2016, Journal of Electronic Materials.

Design and analysis of Cu circuit for stretchable electronic circuits using finite element analysis

S. Jung, Choong-Jae Lee, Kyung-Yeol Kim, 2021, Microelectronic Engineering.

Mechanical properties and microstructures of Cu/In-48Sn alloy/Cu with low temperature TLP bonding

D. Kang, Kyung-Yeol Kim, Seung-Boo Jung, 2022, Electronic Components and Technology Conference.

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test.

Haksan Jeong, W. Myung, Kyung-Yeol Kim, 2018, Journal of nanoscience and nanotechnology.