S. Cheng

The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu

Kwang-Lung Lin, S. Cheng, 2002 .

Influence of substrate temperature to prepare (1 0 3) oriented AlN films

Kuan-Ting Liu, Ruyen Ro, Sean Wu, 2010, Microelectronics Reliability.

The effects of gallium additions on microstructures and thermal and mechanical properties of Sn-9Zn solder alloys

Chin‐Hsiang Cheng, Sean Wu, T. C. Cheng, 2014 .

The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders

Kang-I Chen, S. Cheng, Chin Hsiang Cheng, 2013 .

Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn–9Zn eutectic alloy

Sean Wu, Kang-I Chen, Shou-Chang Cheng, 2006 .

Microstructure and Mechanical Properties of Sn-8.55Zn-1Ag-XAl Solder Alloys

Kwang-Lung Lin, S. Cheng, 2005 .

Interfacial evolution between Cu and Pb–free Sn–Zn–Ag–Al solders upon aging at 150 °C

Kwang-Lung Lin, K. Lin, S. Cheng, 2003 .