R. Schaefer

Analysis of test coupon structures for the extraction of high frequency PCB material properties

J. Moreira, H. Barnes, R. Schaefer, 2013, 2013 17th IEEE Workshop on Signal and Power Integrity.

Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag

Daniel Lewis, Richard P. Vinci, Michael R. Notis, 2004 .

The optimum design of honeycomb solar ponds and a comparison with salt gradient ponds

Preston Lowrey, P. Lowrey, R. Schaefer, 1992 .