Jian Zhu

Deep Hole Fabrication Based on ICP Process

Long Zhang, Min Zhuo, Anseime Chen, 2009 .

Study on the Gold-Gold Thermocompression Bonding for Wafer-Level Packaging

Shi Xing Jia, Jing Wu, Yun Xiang Wang, 2009 .

Investigation on Fine Polishing Technique of Silicon Wafer

S. Jia, Q. C. Gong, Jian Zhu, 2009 .