Mengying Tan

Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process

Fang Ma, Min-bo Zhou, Xin-Ping Zhang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

C. Ke, S. Liang, Xin-Ping Zhang, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).