D. E. Riemer

Evaluating thermal packaging concepts using thermal impedance

D. E. Riemer, 1997 .

Integrated circuit active phased array antennas for millimeter wave communications applications

S. H. Goodman, D. E. Riemer, David N. Rasmussen, 1994, Proceedings of IEEE Antennas and Propagation Society International Symposium and URSI National Radio Science Meeting.

The Theoretical Fundamentals of the Screen Printing Process

D. E. Riemer, D. Riemer, 1989 .

Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates

D. E. Riemer, D. Riemer, 1990, 40th Conference Proceedings on Electronic Components and Technology.

Thermal impedance of microwave integrated circuits with localized small heat sources

D. E. Riemer, 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

Packaging design of wide-angle phased-array antenna for frequencies above 20 GHz

D. E. Riemer, 1995 .