Kazuaki Ano

Risk Assessment Study of Package Warpage by using Bayesian Networks

Kazuaki Ano, 2019, 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).

Risk Assessment Study of Copper Pillar Structure by using Bayesian Networks

Kazuaki Ano, 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC).

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kazuaki Ano, Darvin R. Edwards, King-Ning Tu, 2005 .