Yuexin Zhang

The thermal cycling reliability of copper pillar solder bump in flip chip via thermal compression bonding

Xiaohe Liu, Zhuo Chen, Junhui Li, 2020 .

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junhui Li, Yuhua Guo, J. Dai, 2022, Journal of Electronic Packaging.

Fatigue crack initiation prediction of cope hole details in orthotropic steel deck using the theory of critical distances

Hong Yu Zhou, Xiuli Du, Z. G. Wang, 2016 .

Mechanical Behavior and Constitutive Model Characterization of Optically Clear Adhesive in Flexible Devices

Sheng Liu, Z. Qian, Kun Ma, 2022, Micromachines.

Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure

Junhui Li, Tianxiang Wu, Wenya Tian, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Optimization of Cu protrusion of wafer-to-wafer hybrid bonding for HBM packages application

Fang Dong, Sheng Liu, Hehui Zhang, 2022, Materials Science in Semiconductor Processing.