J.B. Dezord

Dbc (direct bond copper) substrate with integrated flat heat pipe

C. Schaeffer, O. Puig, J. Schulz-Harder, 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.

Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for the Cooling of Power Electronics Packaging

C. Schaeffer, J.B. Dezord, Y. Avenas, 2006, 2005 IEEE 36th Power Electronics Specialists Conference.