Y. Avenas

Dbc (direct bond copper) substrate with integrated flat heat pipe

C. Schaeffer, O. Puig, J. Schulz-Harder, 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.

Analytical investigation of flat silicon micro heat spreaders

Y. Avenas, S. Tzanova, M. Ivanova, 2004, Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting..

Thermal characterization of flat silicon heat pipes

C. Schaeffer, Y. Avenas, C. Gillot, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions - Comparison with infrared measurements

L. Dupont, Y. Avenas, L. Dupont, 2012, Microelectron. Reliab..

Experimental study of a flat silicon heat pipe with microcapillary grooves

C. Schaeffer, Y. Avenas, C. Gillot, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).