Chenkan Yan
发表
Gang Liu,
X. Cui,
P. Lin,
2019,
JOM.
A. Feng,
Jun Shen,
Jingli Sun,
2018,
Materials Science and Engineering: A.
Jun Shen,
P. Lin,
Chenkan Yan,
2018,
High Temperature Materials and Processes.
Kai Zhu,
Weikun Xie,
Dun Wang,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).