Yang Liu

Cu–Cu bonding using bimodal submicron–nano Cu paste and its application in die attachment for power device

Zhi-Quan Liu, Rong Sun, Yue Gao, 2022, Journal of Materials Science: Materials in Electronics.

Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration

Quan Sun, Yang Liu, Yongzhe Xu, 2023, Journal of Materials Science: Materials in Electronics.