G. Elbaz

300mm Heterogeneous 3D Integration of Record Performance Layer Transfer Germanium PMOS with Silicon NMOS for Low Power High Performance Logic Applications

G. Dewey, B. Chu-Kung, J. Kavalieros, 2019, 2019 IEEE International Electron Devices Meeting (IEDM).

Staggered Metallization with Air gaps for Independently Tuned Interconnect Resistance and Capacitance

R. Krishnamurthy, M. Reshotko, H. Kaul, 2020, International Electron Devices Meeting.