Fangcheng Duan
发表
C. Hang,
Hongtao Chen,
Jianqiang Wang,
2022,
Journal of Materials Science: Materials in Electronics.
Hongtao Chen,
Xueting Zhao,
Luobin Zhang,
2021,
Journal of Electronic Materials.
A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging
C. Hang,
Fengyi Wang,
Hongtao Chen,
2022,
Materials.
Hongtao Chen,
Luobin Zhang,
Zi-wen Lv,
2022,
Nanomaterials.
Mingyu Li,
Jiahao Liu,
Hongtao Chen,
2022,
International Conference on Electronic Packaging Technology.
C. Hang,
Hongtao Chen,
F. Wang,
2023,
Surface & Coatings Technology.
Jiahao Liu,
Hongtao Chen,
Xiaofeng Yang,
2023,
Applied Sciences.
Mingyu Li,
C. Hang,
Hongtao Chen,
2022,
Journal of Materials Research and Technology.
C. Hang,
Jiahao Liu,
Hongtao Chen,
2023,
Journal of Materials Science: Materials in Electronics.
Hongtao Chen,
Jianqiang Wang,
Jintao Wang,
2023,
Scientific Reports.
Luobin Zhang,
Jianqiang Wang,
Zi-wen Lv,
2023,
Acta Materialia.
C. Hang,
Jiahao Liu,
Hongtao Chen,
2022,
International Journal of Adhesion and Adhesives.