Avi Yaverboim

Electroless Plating and Printing Technologies

Y. Shacham-Diamand, Y. Sverdlov, Stav Friedberg, 2017 .

Binuclear Copper Complex Ink as a Seed for Electroless Copper Plating Yielding >70% Bulk Conductivity on 3D Printed Polymers

M. Layani, S. Magdassi, Yousef Farraj, 2018 .