Jiao Wang

Warpage and Reliability Simulation of Super-Size Embedded Silicon Fan-out (eSiFO) Package with size 40mm×40mm

Zhiyi Xiao, Shuying Ma, Dongzhi Fu, 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).

Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Daquan Yu, Zhiyi Xiao, Shuying Ma, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Process Development and Failure Analysis of Super-Size Embedded Silicon Fan-out Package

Shuying Ma, Dongzhi Fu, Jiao Wang, 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).