P. Roumanille

Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components

A. Guédon-Gracia, H. Frémont, S. Pin, 2020 .

Enhancement of the piezoelectric effect in Fe-substituted GaAsO4: A combined XRD, Raman spectroscopy and first principles study

J. Haines, D. Zheng, O. Cambon, 2020, Solid State Sciences.

Bi2(C2O4)3·7H2O and Bi(C2O4)OH Oxalates Thermal Decomposition Revisited. Formation of Nanoparticles with a Lower Melting Point than Bulk Bismuth.

P. Tailhades, B. Duployer, V. Baco-Carles, 2017, Inorganic chemistry.

Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling

A. Guédon-Gracia, H. Frémont, P. Nguyen, 2021, 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).

Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging

J. Delétage, A. Guédon-Gracia, H. Frémont, 2021, Microelectronics Reliability.