Xu Han

Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint

Xiaoyan Li, Gang Yang, Shan-lin Li, 2022, Soldering & Surface Mount Technology.

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

Xiaoyan Li, Xiaoyan Li, P. Yao, 2019, Soldering & Surface Mount Technology.

On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu–Sn solder joints

G. Ji, Xiaoyan Li, Xu Han, 2022, Journal of Materials Science: Materials in Electronics.

Experimental and numerical investigations of adhesively bonded carbon/carbon composites subjected to interlaminar shear loads

Hongwei Wu, Haibo Luo, Xin Li, 2019, Journal of Adhesion Science and Technology.

Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging

Hu Zhang, S. Li, Linjie Wen, 2022, Microelectronics Reliability.