Shih-Chi Yang

Single-crystal-like Cu joints with high strength and resistance to fatigue failures

Dinh-Phuc Tran, Po-Ning Hsu, J. Ong, 2022, Materials Science and Engineering: A.

MicroRNAs in the regulation of interfacial behaviors of MSCs cultured on microgrooved surface pattern.

Guoqiang Chen, Qiong Wu, Chao Yan, 2011, Biomaterials.

A DEP-assisted single-cell electroporation chip with low operation voltage

Zheyao Wang, Cheng Wang, Jinpeng Wang, 2010, 2010 IEEE Sensors.

Potassium hydroxide surface modification for low temperature Cu/SiO2 hybrid bonding

Hsiang-Hung Chang, Dinh-Phuc Tran, Chin-Hung Wang, 2023, Surfaces and Interfaces.

Periodic Reverse Electrodeposition of (111)-oriented Nanotwinned Cu in Small Damascene SiO2 Vias

Hsiang-Hung Chang, Dinh-Phuc Tran, W. Chiu, 2023, Journal of Electroanalytical Chemistry.

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Dinh-Phuc Tran, W. Chiu, J. Ong, 2023, Applied Surface Science.

Evolution of interfacial voids in Cu-to-Cu joints

Dinh-Phuc Tran, K. Tu, J. Ong, 2022, Materials Characterization.

Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints

Hsiang-Hung Chang, K. Tu, Ching-Yu Chiang, 2023, Nanomaterials.