Thomas J. Haigh

Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect

Kumar Virwani, Son Van Nguyen, Hosadurga Shobha, 2017 .

UV Cure Enabled Robust STI Oxide Gap Fill Solution for Thermally Limited Flow in Advanced Logic Devices

Richard A. Conti, Thomas J. Haigh, Yiping Yao, 2016 .

Ultrathin (8-14 nm) Conformal SiN for sub-20 nm Copper/Low-k Interconnects

Daniel C. Edelstein, Alfred Grill, Jay Burnham, 2014 .